Pentax Engineers About Camera Design

Pentax Engineers About Camera Design

Pentax engineers are usually more open talking about technical problems than their collegues from other companies. OK1000 Pentax blog translated an interview about K10D DSLR design and decision process at Pentax.
A few cuts from the interview showing problems with camera board design:

"It doesn’t take long to produce an acceptable level of quality images at the base sensitivity (ISO 100), however, as the sensitivity increases step by step, at some point, terrible images will be produced. The real effort starts from this point, trying to pin point possible reasons, mainly by trial and error, often having to make new Cbs (circuit boards). At the same time, firmware is developing along and each group has to closely coordinate in order to slowly improve image quality. Fine tuning can only commence after this point.

The frequency of designing new circuit boards might be hardest hurdle in the whole K10D project.

Homogeneous noise across the whole image could often be permitted, but countermeasures against localized noise is difficult to achieve.

Of course, each case is closely analyzed and dealt with, but there are a number of cases of localized noise and it is really time consuming to solve these. Changing Cb’s is one measure, but that has to be repeated many times.

We were fully aware that we were going to face very critical eyes on the noise issue because of increased resolution. In addition, the base sensitivity of the sensor was lower, which made tuning to the acceptable level for production very difficult.

Recent Cbs might look at one piece, but there are actually layers to this and a slight change in wiring alone significantly changes how noise appears. In a digicam, DDR2 memory that functions at a very high frequency and many other parts all produce radio waves. A TV tuner portion of a videocard for PC, for example, is tightly shielded in order to avoid the interference between the digital circuit and analog circuit. If noise enters before signal’s digitization, the digital image output would almost be unusable. When increasing the gain for sensitivity, at ISO1600 for example (4 stops over base sensitivity), just a slight voltage variation in the order of a few milli-volts will impose a huge impact on image quality.

Separating grounding circuits is one way, but it is not simply a matter of separation. Sometimes, good results could be obtained by a larger grounding area. This is another area requiring the trial and error method.
"

Some other design trade-offs and considerations of DSLR image sensor customers make this interview worth reading.
Acutelogic Image Processing Solutions

Acutelogic Image Processing Solutions

Acutelogic is yet another embedded image processing software vendor. It has quite a complete set of image processing routines, covering wide set of applications. Canon,Fujifilm, Pentax, Samsung are all among its clients.
What sets Acutelogic apart of others is a still image stabilization subroutine:

"Image stabilizer software for still images and video--Being a pure software implementation, this application requires no additional hardware such as gyro-sensors. Our still image stabilizer results not only in reduced blur but improved noise characteristics when used in low-light conditions."

Sounds like they are solving the holy grail of digital imaging. I'm wondering if it's a similar idea to Sony 60fps sensor stabilization? Or it's like Stanford's Abbas El-Gamal solution squeezed into OMAP footprint in some magical manner?
Varioptic and Creative Sensors Go in Mass Production

Varioptic and Creative Sensors Go in Mass Production

SourceWire: As announced in August 2006, Creative Sensor set up the production line for liquid lenses with the support of Varioptic. The manufacturing capacity in Wuxi, China is now at 100,000 liquid lenses per month and will be increased to 1 million units per month by the end of 2007.

Production includes Varioptic’s new 7.75-mm lenses, Arctic 416, aimed at camera phones, as well as the previously introduced devices, Arctic 320, for use in webcams, barcode readers and medical equipment.
Photron High-Speed Sensor

Photron High-Speed Sensor

Photron has announced world's fastest Mega-pixel video camera, having over 5,000fps at mega pixel resolution. Its brand new CMOS sensor provides 12b pixel depth and is capable of reduced resolution operation as fast as 150,000 fps.

5,000fps at megapixel resolution frame translates to about 200ns per row, depending on the image format. Even considering 2-sided readout of few rows in parallel, the speed is very impressive.

Most probably the sensor was developed in cooperation with Alexima.

BeSang Image Sensor Promise

BeSang start-up company (Portland, OR) promises new "high quantum efficient image sensor" based on its "3D Enabling Technology". From the first sight its chip stacking technique is quite similar to ZyCube.
The company was founded by Sang-Yun Lee, who used to work for Samsung, Motorola and IDT. It looks like BeSang does not have institutional investors, as of yet.

ZyCube and Oki Team on Image Sensor Packaging

EETimes: ZyCube and Oki Electric combine their technologies to offer chip-sized packaging technology for both CMOS and CCD image sensors.

ZyCube 3D CSP will compete with Tessera-Shellcase CSP. Oki seems to be the early adaptor of this package, just like Sanyo was for Shellcase at the time.

On paper ZyCube package looks extremely attractive, albeit a little complex. But the real question is can it compete on price and yield?

ProMOS to make Image Sensors in China

ProMOS to make Image Sensors in China

EETimes: ProMOS said it will invest $360 million in the 200mm wafer fab in the city of Chongqing that will produce CMOS image sensors, among other ICs. State-controlled banks will lend another $360 million, while the Chongqing government will put up about $200 million to build the fab, and then lease it to ProMOS. If things go well, ProMOS will eventually buy the facility.

The clean room should be finished by the end of this year. Mass production will begin in the second quarter of 2008. The planned capacity is 60,000 wafers per month. ProMOS will buy new equipment for the first 20,000 wafers, and then transfer used equipment from a fab in Taiwan for the rest. Initially, ProMOS will use 0.25 micron design rules and then migrate to more advanced technology as the fab reaches full capacity by 2009.

Digitimes presents a slightly different ProMOS fab schedule: ProMOS first 8-inch fab in China at Chongqing will have pilot runs slated to start during the end of the year and volume production slated for the first quarter of 2008.
Micron Security Presentation

Micron Security Presentation

ESMChina put out Micron's presentation of products for security market. My favorite number in it is 82.1 patents per 1K employees per year, which puts Micron into leadership position. Sounds quite funny. I can think of this number expressed as 82.1 Kilo-patents per 1 Mega-employee or as 82.1 milli-patent per employee. In Kilo-patents it looks bigger.
Fairchild Imaging CCD-CMOS Hybrid

Fairchild Imaging CCD-CMOS Hybrid

PRWeb: Fairchild Imaging announced an interesting CCD-CMOS hybrid sensor. The company says:

"The novel hybrid image sensor combines the best of both CCD and CMOS technologies: the high image quality, low dark current and high fill-factor of a CCD with the high speed, low-noise and low power of a CMOS readout. The 1.3 megapixel hybrid sensor delivers extreme low-light imaging performance at video and supra-video frame rates."

To me this sounds like a regular 4T pixel sensor, may be fabricated on CCD fab in CCD-compatible process. Personally, I'm sceptical about Fairchild Imaging capabilities to deliver a real breakthrough here.

Update Feb 4, 2007:
Fairchild Imaging published a paper on the hybrid imager approach. It's quite an exotic imager having CCD combined with column-parallel CMOS readout attached on indium bumps. The chip was developed under US Army contract. Quite an expensive technology, even for military.

Lyra Research Cameras Forecast

Lyra Research published its digital camera market forecast up to 2010.

According to the forecast worldwide digital camera shipments rose 21 percent in 2006 to approximately 98 million units. This sizeable growth occurred despite household penetration of greater than 50 percent in Japan, the United States, and leading nations in Western Europe, and in spite of multimegapixel camera phones becoming commonplace in Asia and Europe. Lyra's forecast now projects worldwide digital camera shipments to exceed 130 million units in 2010 for a compound annual growth rate (CAGR) of more than 10 percent.

Sales in 2006 showed that consumers' appetite for digital cameras has not been abated by the spread of camera phones or by existing digital cameras in the household," comments Steve Hoffenberg, Lyra's director of consumer imaging research. "Current digital camera users upgraded in droves to new models offered by every major manufacturer, lured by image-stabilization features, broader zoom lens ratios, and higher-resolution sensors. While the upgrading activity will eventually taper off, it shows little signs of vanishing through the end of the decade, as camera makers continue to pack more value into their products."

Omnivision Stock is Downgraded Again

Omnivision Stock is Downgraded Again

Yahoo-Finance: J.P. Morgan analyst Paul Coster wrote in a note to investors: "OmniVision is locked in price-based competition in the low-margin VGA segment of the CMOS sector space . . . and is unable to differentiate, absent the introduction of WFC (Wavefront Coding) or a lower cost next generation chip set."
Magnachip Al vs Cu Backend Comparison

Magnachip Al vs Cu Backend Comparison

A year-old Magnachip paper comparing optical properties of Al an Cu backend pixels just came to my attention. Not really fair comparison as the metal stack hight is almost same in their simulation. It shows what happens if one does not remove SiC or SiN barrier layers in Cu process - quite predictable result.
Lumerical Microlens Simulator

Lumerical Microlens Simulator

I've just noticed that Canadian company Lumerical offers an optical microlens FDTD simulator. It seems to be in use by ST, looking on a footnote. Breault Research has 3um pixel microlens simple simulation examples using Lumerical FDTD. They also published a paper about it.

There is a competing FDTD simulator by OptiWave, incidentally also Canadian company. Stanford students use it for pixel simulations, as described in the paper.

Anybody can share an opinion on these simulators, good or bad? How they compare with TOCCATA by Link Research or Sentaurus by Synopsys?
EDN on Image Sensors

EDN on Image Sensors

EDN published an article on consumer image sensors problems:

"For a given sensor size—and hence price range—increasing the pixel count means decreasing the active area of the photodiode, and hence lowering the sensitivity and/or the signal-to-noise ratio. Already in the 6-megapixel range, sensitivity has been reduced enough to seriously compromise image quality at low light levels.

One possible solution comes from Toshiba, which is working on a way to get more light to the active area. Today the individual microlenses that are bonded onto the surface of the image-sensor array are circular—so the lens doesn't collect light from the whole rectangular area of the pixel cell, only from a circular area that fits inside the rectangle. Toshiba researchers are working on a rectangular microlens that would cover the entire pixel area, substantially increasing light-gathering efficiency.
"

Well, Micron has these high-quality microlens for years. Toshiba is catching up here.

"Toshiba is also working on the system-architecture problem. In many cell-phone handset designs today, even the pixel-level post-processing to remove noise and bias from the raw CMOS sensor data is done on the handset's baseband or applications processor. But, according to Toshiba vice president Andrew Burt, while that solution is attractive to platform developers for cost reasons, it is losing its appeal with handset manufacturers, who find that the design team that created the sensor should remain in control of the pixel-level processing. This is tending not only to put the pixel-level signal-processing hardware back on the sensor die, but also to enlarge the definition of what needs to happen at the pixel level. "As resolutions approach 5 to 8 megapixels, we see image-processing applications migrating onto the pixel processor," Burt said."

I think this is another way to say that sensor's raw data is so bad that it's a shame to show it to anybody without at least basic fixes on the sensor itself.

Then EDN says about video camera sensor problems:

"At least one insider sees video cameras heading down the same road. Cameras are moving to true HD: 1080-line, progressive-scan imaging. That means the consumer is going to be looking at the output of a handheld camera on an HD screen in high resolution. The consumer is not going to be happy.

Part of the problem is refresh rate. "Hollywood can make movies at 24 frames per second," observes Didier LeGall, executive vice president at Ambarella. "But they have professional cinematographers and specifications written right into the script about how fast a pan or zoom will be, how a camera will track, how fast the hero will run across the scene, and so on.

A novice recording HD sequences with a handheld camera, swinging it around, zooming in and out, is going to create flicker and motion artifacts at anything like a 24 fps refresh rate. That is one of the reasons the industry is moving rapidly toward 120 Hz.
"
Apple iPhone Guessing Game

Apple iPhone Guessing Game

Who's supplying components for iPhone? The speculations are filling the web. Investors.com writes on 2MP image sensor supplier:

"Mosesmann and other analysts say Apple apparently has chosen a Micron image sensor for the iPhone's 2-megapixel camera. Companies that make chips for i- Phone will get a real plum in sales. Apple expects to ship as many as 10 million iPhones a year by 2008."

Sounds like a good guess to me.
More on ProMOS Image Sensors Venture

More on ProMOS Image Sensors Venture

Digitimes: With regard to speculation that ProMOS Technologies may work with Cypress Semiconductor for CMOS image sensor (CIS) production, ML Chen, chairman of ProMOS, said he would not deny the speculation, but further details will not be announced until after more discussions.

According to ProMOS, it plans to start the new business with US$10 million in capital, and ProMOS will hold 100% of the new entity. Nevertheless, the maker is not ruling out introducing other strategic partners while ProMOS will remain the major shareholder of the company, Chen said.

ProMOS announced on January 11 that its Fab 2 (a 12-inch fab) will start producing CIS. Chen said the fab will be the first choice of the new design company for CIS production and the fab will also compete for orders from other companies. The fab will use 0.11-micron technology, more advanced than the 0.18-micron now used for CIS production.

The fab can produce CIS chips of three megapixel and will focus on high-end CIS, while its entry-level CIS will be taken care by an 8-inch fab in China, the company said.

Although ProMOS will remain focused on DRAM, the maker still needs another revenue driver and CIS is an appropriate choice, Chen said, adding that this is why ProMOS has chosen to ally with a major IDM in the US.

Besides making CIS, Fab 2 will continue manufacturing memory for consumer electronics, ProMOS said.